Résultats de recherche

Description du poste : Au sein de l’équipe de recherche et développement, le designer d’emballage structurel a la responsabilité de créer des emballages pour...

Develop packaging design roadmaps and creative concepts for new product launches, including primary and secondary packaging. Create branded sample packaging and adapt existing dielines as needed. Produce 3D renders of packaging concepts for digital visualization and internal use.

Develop packaging design roadmaps and creative concepts for new product launches, including primary and secondary packaging. Maintain a highly organized file system so packaging assets are easy to reference, update, and version. Reference key documentation to ensure accuracy, including copy spreadsh

Develop packaging design roadmaps and creative concepts for new product launches, including primary and secondary packaging. Create branded sample packaging and adapt existing dielines as needed. Produce 3D renders of packaging concepts for digital visualization and internal use.

Develop packaging design roadmaps and creative concepts for new product launches, including primary and secondary packaging. Support urgent packaging updates when needed, typically with a 24-hour turnaround for high-priority changes. Packaging Types You’ll Work On.

Develop packaging design roadmaps and creative concepts for new product launches, including primary and secondary packaging. Reference key documentation to ensure accuracy, including copy spreadsheets, packaging agendas, and Jira tickets. Support urgent packaging updates when needed, typically with

A leading connectivity solutions provider in Ottawa seeks a Senior Opto-Mechanical Engineer to develop innovative optical packaging solutions. This role requires extensive experience in packaging development, collaboration with global teams, and hands-on product development.

A global technology firm in Ottawa is seeking an experienced Hardware Engineer to contribute to innovative designs for Data Center and Carrier Service Provider solutions.The role involves overseeing complex failure analysis and collaborating with suppliers and designers on cutting-edge technology.Th

A leading technology firm is seeking an industry expert in Ottawa to lead process architecture and development for next-generation optical and microelectronic solutions.The role requires deep expertise in flip-chip and wire bonding processes, with a Master's degree in a relevant engineering discipli

Software Engineer (Python/Linux/Packaging). Software Engineer (Python/Linux/Packaging). Canonical Software Engineer (Python/Linux/Packaging).

The ideal candidate has over 8 years of experience in microelectronics packaging and deep expertise in Flip Chip and Wire Bonding processes.