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Vos résultats de recherche pour le mot clé packaging

Description du poste : Au sein de l’équipe de recherche et développement, le designer d’emballage structurel a la responsabilité de créer des emballages pour...

6 février 2024 par Tween Team
Montreal, Quebec, Canada

A leading technology firm in Ontario is seeking an Advanced Packaging Engineer to design and develop complex components and packaging.

28 janvier 2026 par RANOVUS Inc.
Montreal, Quebec, ca

The ideal candidate has 5-8 years in product management and strong knowledge in HPC and advanced packaging technologies.

28 janvier 2026 par Tech Insights
Montreal, Quebec, ca

Job Title Advanced Packaging Engineer. Design and develop complex sub‑assemblies, components, and packaging as assigned.

28 janvier 2026 par RANOVUS Inc.
Montreal, Quebec, ca

The ideal candidate has over 8 years of experience in microelectronics packaging and deep expertise in Flip Chip and Wire Bonding processes.

28 janvier 2026 par Sanmina
Montreal, Quebec, ca

JOB SUMMARY Develops and implements production/processing methods and controls to meet quality standards in the most efficient manner for Photonic and Electronic Advanced Packaging. At least five years of compatible experience with advanced packaging, particularly flip‑chip, die bond, wire bond an

28 janvier 2026 par Jabil
Montreal, Quebec, ca

A leading semiconductor information platform in Ottawa is seeking a Technical Product Manager for High Performance Computing.This role involves defining product roadmaps, engaging with clients, and utilizing AI to enhance product performance.The ideal candidate will have 5-8 years in product managem

28 janvier 2026 par TechInsights
Montreal, Quebec, ca

Canonical Software Engineer (Python/Linux/Packaging). Software Engineer (Python/Linux/Packaging). Python, Packaging and Linux skills.

28 janvier 2026 par Canonical
Montreal, Quebec, ca

A global technology firm in Ottawa is seeking an experienced Hardware Engineer to contribute to innovative designs for Data Center and Carrier Service Provider solutions.The role involves overseeing complex failure analysis and collaborating with suppliers and designers on cutting-edge technology.Th

28 janvier 2026 par Nokia
Montreal, Quebec, ca

The ideal candidate will have at least 8 years of hands-on experience in microelectronics packaging and strong expertise in processes like Flip Chip and Wire Bonding.

28 janvier 2026 par SANMINA-SCI TECHNOLOGY INDIA PRIVATE LIMITED
Montreal, Quebec, ca

The Territory sales Manager position is primarily responsible for driving profitable revenue dollars within a general geographic region.In this role, we seek outstanding organizational and sales skills.We expect you to be an excellent communicator who understands customer needs.This position will st

27 janvier 2026 par Mauser Packaging Solutions
Montreal, Quebec, ca